Applications

Semiconductor Testing

XARION’s unique laser-based technology enables the ultrasonic NDT inspection of semiconductor components without any contact, water or coupling liquid. XARION’s semiconductor test equipment is available as a stand-alone desktop tool for semiconductor testing in fail labs and R&D laboratories and can also be integrated into a high-volume production line to enable 100% quality control.

The desktop station offers two operation modes: a high-speed, non-contact imaging mode, and the ultrafast single-shot quality control mode. Both modes enable electronic chip testing by offering non-contact, non-destructive detection of delamination and other internal defects. In the imaging mode, these defects can be located and analyzed in detail, while the single-shot mode offers unparalleled speed with up to 1000 components inspected per second. Utilizing XARION’s technology increases your productivity in failure analysis and greatly improves reliability in production!

Ultrasonic Inspection of Composite Materials

XARION’s Laser-Excited Acoustics (LEA) technology is a game-changing new method of NDT for composites and composite material testing. The technology allows for high-resolution imaging of internal defects, such as delamination or porosity. LEA is easy to integrate into robotic or scanning inspection systems and is also available as a turnkey LEAsys scanner solution. The turnkey station enables composite NDT in R&D laboratories in industry and academic institutions. For high-throughput industrial production settings, customized solutions are offered that utilize the same technology and take composite material testing to a new level!

With XARION LEA, a pulsed laser generates an ultrasound wave directly in the part and that wave is detected with XARION’s proprietary ultrasound detector, delivering sensitivity and resolution to match today’s standard liquid-coupled UT. The technology eliminates the need for water or coupling gel, allowing for seamless integration into production environments. The compact LEA probe is fully fiber-coupled and designed for robotic integration. Its robustness against misalignment and surface variations ensures a high signal-to-noise ratio across the entire inspection area and minimizes the need for costly manual testing.